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Mechanical Dimensions
.
12.80±0.20
A
11.930
B
7.50±0.10
10.325
20
11.430
1 1
11.430
10.922
8.422
PIN ONE
INDICATOR
1
0.51
0.35
0.25
M
1.27
C B A
10
1.25 TYP
1.27 TYP
0.50 TYP
LAND PATTERN RECOMMENDATION
2.65 MAX
0.20±0.10
C
0.10 C
SEE DETAIL A
SEATING PLANE
0.33
0.20
0.75
0.25
X 45°
20
PIN#1 IDENTIFICATION OPTIONS
20
20
(R0.10)
(R0.10)
8°
0°
0.40~1.27
GAGE PLANE
0.25
SEATING PLANE
(1.40)
DETAIL A
SCALE: 2:1
NOTES: UNLESS OTHERWISE SPECIFIED
PIN #1
INDICATOR
1
PIN #1
INDICATOR
1
PIN #1
INDICATOR
1
A) THIS PACKAGE CONFORMS TO JEDEC MS-013.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATTERN RECOMMENDATION IS FSC DESIGN
E) FILENAME AND REVISION: M20Brev4
OPTION 1
HALF MOON & PIN 1
OPTION 2
HALF MOON ONLY
OPTION 3
PIN 1 ONLY
Figure 31. 20-Lead Small Outline Package (SOIC)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor ’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
? 2008 Fairchild Semiconductor Corporation
FAN7888 ? Rev.1.0.1
13
www.fairchildsemi.com
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